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Blog
- A New Kind of Computer
- Building out the Photonic Stack
- Doubling Down: World’s First 16-λ Single Fiber Bidirectional Link for AI
- Interconnect Is All You Need: Final Nodes, Big Chips, and Photonics
- Lightmatter and GlobalFoundries® Partner to Mass Produce Passage™ Platform
- Scale-Up is a Problem Made for Photonics
- Seeing is Believing: A Technical Deep Dive into Lightmatter’s Hardware
- Wide and Parallel Wins
Press Releases
- Industry Leaders Formally Launch CPO System Architecture Initiative Within the Open Compute Project
- Lightmatter Accelerates Growth and Expands Photonic Chip Deployments With $155M in New Funding; Now Valued at $1.2B
- Lightmatter Achieves Record 1.6 Tbps Per Fiber to Accelerate AI Optical Interconnect
- Lightmatter Achieves World-First 16-Wavelength Bidirectional Link on Single-Mode Optical Fiber
- Lightmatter and ASE Partner to Bring 3D Photonics to Market
- Lightmatter and Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure
- Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers
- Lightmatter Announces NVIDIA Executive Simona Jankowski as Chief Financial Officer
- Lightmatter Announces Passage L200, the Fastest Co-Packaged Optics for AI
- Lightmatter Announces Reference Architecture Initiative with Industry Leaders in the Open Compute Project for Co-Packaged Optics
- Lightmatter Appoints Intel Veteran Ritesh Jain as VP of Engineering, Systems and Packaging
- Lightmatter Appoints Richard Beyer and Robin Washington to its Board of Directors
- Lightmatter Collaborates with Synopsys to Integrate Advanced Interface IP with Its Passage Co-Packaged Optics Platform
- Lightmatter Expands Photonic Interconnect Roadmap with Passage™ L20 Unified Optical Engine for NPO and OBO Applications
- Lightmatter Introduces Guide Light Engine for AI, Featuring VLSP Technology
- Lightmatter Joins NVIDIA NVLink Fusion and Powers Next-Generation AI Infrastructure with Photonic Interconnects
- Lightmatter Joins Open CPX MSA, Introduces the Industry’s First Bidirectional CPX Optical Engine
- Lightmatter Joins UALink™ Consortium to Propel AI Interconnect into the Photonic Era
- Lightmatter Joins XPO MSA as Founding Member to Accelerate High-Density Optical Interconnects for AI Data Centers
- Lightmatter Names Roy Kim Vice President of Product to Lead Global Deployment of Photonic Interconnects
- Lightmatter Raises $400M Series D; Quadruples Valuation to $4.4B as Photonics Leader for Next-Gen AI Data Centers
- Lightmatter Unveils Guide DR: Industry First Liquid-Cooled Laser NIC that Quadruples Rack Density
- Lightmatter Unveils Passage M1000 Photonic Superchip, World’s Fastest AI Interconnect
- Lightmatter Unveils vClick™ Optics, Industry-First Detachable Fiber Array Unit for CPO Advanced Packaging and High-Volume Production
- Lightmatter Welcomes Industry Leader Jason Zander to Its Board of Directors
- Lightmatter, Harvard and Boston University Collaborate to Create Electro-Photonic Systems for Autonomous Vehicles Under New $4.8M IARPA Project
- The Future Is Bright — Lightmatter Raises $154M to Deliver Photonic Products to Customers
Knowledge Hub
Resources
- AI With Sally: AI’s Next Scaling Challenge Is Interconnect
- CHIPCon 2025 with Sandeep Sane, Sr. Director, Head of Packaging
- Fireside Chat with Lightmatter Founder & CEO Nick Harris at Web Summit 2025
- Guide 1 EVK: 16λ DWDM Optical Source Demo
- High-Bandwidth Optical Links, Nikhil Kumar, Senior Director, Photonics
- Hot Chips (Advance Program) 2025, Darius Bunandar, Chief Scientist
- Hot Interconnects 2025, Nick Harris, CEO & Founder
- Hot Interconnects 2025, Nick Harris, CEO & Founder
- Hot Interconnects 2025, Taylor Groves, Principal Solutions Architect
- Hot Interconnects 2025, Taylor Groves, Principal Solutions Architect
- Hot Interconnects 2026 Presentation, Nick Harris, Ph.D., Founder and CEO
- How to Innovate at the Speed of Light with Nick Harris of Lightmatter
- IEEE Hot Interconnects 2026 Best Paper, Presented by Arul Madhavan, Senior Staff Machine Learning Engineer
- Inside the Architecture: Bob Turner on Lightmatter’s 16-Lambda Bidirectional Link, Supercomputing 25
- Inside the Lightmatter Booth: Exclusive Hardware Tour at Supercomputing 2025
- Inside the Lightmatter Booth: Exclusive Hardware Tour at Supercomputing 2025
- ISES Korea 2025, Ritesh Jain, SVP Engineering and Operations
- Lightmatter Announces New OCP Standard for Rack-Scale Co-Packaged Optics
- Lightmatter at OFC 2026: Optical Interconnects in Action
- Lightmatter Exhibition, Booth #5145, Optical Fiber Conference 2025, Moscone Center, San Francisco
- Lightmatter InterConnect 2026 | The Future of AI Runs on Light
- Lightmatter InterConnect Launch Event at OFC 2025
- Lightmatter Silicon Photonics, from Wafer to Rack: How the World’s Fastest AI Interconnects are Made
- Lightmatter’s 8X Leap: World-First 16-Wavelength Bidirectional Optical Link for AI Data Centers
- NextGenInfra: Lightmatter on Breaking the AI Interconnect Bottleneck, Steve Klinger, VP of Product
- NextGenInfra: Lightmatter’s Optical Interconnects for AI Scale-Up, Steve Klinger, VP of Product
- Nick Harris, Lightmatter Founder & CEO Presents at Web Summit 2025
- OCP Webinar: Scaling Up Networking for AI: Unlocking the Full Potential of Optical Interconnects
- OFC 2025 Special Event: Panel Discussion: Women at the Forefront of Optical Communication, Joyce Poon, Sr Director, Photonics Architecture
- OFC 2025: Monolithically Integrated Microring Transmitter and Receiver for High-Density 3D Co-Packaged Optics
- OFC 2025: The Marriage of AI and Optical Networking, Darius Bunandar, founder and chief scientist, Lightmatter, 15:45–16:45 PM, Theater III, Moscone Center, San Francisco
- OFC 2026 Technical Session, Alexander Sludds, Photonics Engineer
- One Fiber, Two Directions: The Case for Bidirectional Optics in AI Data Center Scale-Up Networks
- Original Thinkers Wanted: Careers at Lightmatter
- Overcoming Copper Limits: Scaling GPU Pods with Passage at Supercomputing 2025
- Passage EVK50 Demo: 16 Lambda DWDM Bidirectional Optical Link
- Passage M1000: Powering the Next 1000x in AI Performance
- PECC Summit 2025, Darius Bunandar, Chief Scientist
- Ready for Market: Optical Interconnects from XPO to CPO
- Scaling Optical Bandwidth: NPO, DWDM & CPO Innovations at OFC
- Scaling Passage CPO for XPUs & Switches at Supercomputing
- SEMICON Taiwan 2025, Sandeep Sane, Sr. Director, Head of Packaging Technologies
- SMTA International 2025, Jessie Rosenberg, Director of Laser Engineering Lightmatter
- This Week in AI, Nick Harris, CEO & Founder
- This Week in AI, Nick Harris, CEO & Founder, “How the 1% Will Own Compute (and What It Means for You)”
- Yole Group Market Briefing, Nikhil Kumar, Senior Director
Events
- 2026 GSA U.S. Executive Forum
- 2026 OCP APAC Summit
- 2026 OCP EMEA Summit
- 2026 OCP Global Summit
- AI Infra Summit
- AI Infra Summit 2025
- CHIPcon 2025
- Chiplet Summit
- CLEO
- Design Automation Conference (DAC) 2026
- DesignCon
- ECOC 2026
- Electronic Design Process Symposium 2025
- Electronics Packaging Technology Conference
- Hot Chips (Advance Program)
- Hot Interconnects 2025
- Hot Interconnects 2026
- IEEE Electronic Components and Technology Conference (ECTC) 2026
- IEEE ITherm 2026
- IEEE Optical Interconnects and Packaging (OIP) Conference
- IMAPS Executive Summit 2025
- IMAPS SiPhotonics Packaging Summit 2026
- ISES Korea 2025
- ISIG Executive Summit Taiwan
- ISIG Executive Summit USA 2026
- ISSCC (IEEE International Solid-State Circuits Conference)
- ITC 2026
- LightCounting 2026 CPO and NPO Virtual Conference
- Lightmatter at EETimes Chiplet Pavilion at the Design Automation Conference
- NES Optica
- NUCLEUS Symposium at Queen’s University featuring Alex Sludds, Staff Photonics Architect
- OCP 2025
- OCP Canada Tech Day
- OCP Webinar: Scaling Up Networking for AI: Unlocking the Full Potential of Optical Interconnects
- OFC 2025
- OFC 2025 speeches by Darius Bunandar, Chief Scientist, Joyce Poon, Sr Director, Photonics Architecture and Reza Baghdadi, Principal Photonics Design Engineer
- OFC 2026
- Optical Interconnect and Packaging Conference
- PECC Summit – Optica+APC Photonic-Enabled Cloud Computing Summit
- Photonics Spectra Integrated Photonics Summit
- PIC Summit USA
- SEMI Industry Strategy Symposium – ISS 2026
- SEMICON Taiwan
- SEMICON Taiwan
- SEMICON West
- SMTA International, Women’s Leadership Program
- SMTA Wafer-Level Packaging Symposium
- Speech by Eric Yeh, Head of Product at the International Semiconductor Executive Summits (ISES)
- SPIE Photonics West
- SPIE Photonics West
- Supercomputing 2025
- Taiwan Tech Day 2026
- Taiwan Tech Day 2026
- Taiwan Tech Day 2026
Event Sessions
- Advancing AI with Passage Interconnects & Guide Lasers
- CPO Production, Packaging and Quality
- CPO Production, Packaging and Test
- End-to-End Quality and Reliability
- From Vision to Industry Transformation
- Guide Light Engine Deep Dive
- Lightmatter Photonics Technology Overview
- Open Collaboration for CPO in AI Systems
- Passage Photonic Interconnect Deep Dive
- Systems and Rack-Level Integration