Optical Interconnect and Packaging Conference
June 15-17, 2026
Location: Elizabeth Hotel Fort Collins
Presenter: Kaushik Patel, VP, Photonics & Silicon Engineering
Title: From Pluggable to Co-Packaged: Scaling Silicon Photonics HVM for CPO
Abstract: While the industry has already established high-volume manufacturing (HVM) for Silicon Photonics-based pluggable transceivers, scaling HVM for co-packaged optics (CPO) introduces a distinct set of technical and operational challenges. These span the full production stack: delivering known-good optical engines, scalable detachable fiber attachment, and robust assembly, packaging, and test solutions — all while meeting the cost requirements and maintaining the quality and reliability standards that pluggable transceivers have established and that hyperscalers demand.
Meeting these requirements at hyperscale volumes requires a combination of proven and emerging ecosystem partners moving rapidly to close technical gaps. This talk presents Lightmatter’s progress across these areas as we advance toward volume production release of our CPO products.
About OIP:
OIP brings together experts from multidisciplinary fields in a dedicated single-track setting to problem solve the future of interconnects and electro-optical packaging.