2026 OCP APAC Summit
Title: Open Silicon Photonics for AI Systems: From Hyperscale Validation to Open Ecosystem
Presenter: Bijan Nowroozi, Ecosystem Development Director
Abstract: AI training clusters often lose over half their compute to interconnect overhead, with Model FLOPS Utilization (MFU) of 38–43% as copper reach falls from 2 m at 112G to <25 cm at 448G PAM4. Hyperscale CPO is proven in production at 2.6M-hour MTBF, but implementations remain proprietary. 50+ APAC suppliers build AI MHS systems today. What’s missing: an open photonics ecosystem for interoperability.
We present Open Silicon Photonics for AI Systems: a technology-agnostic photonic interconnect architecture extending OCP MHS/ORv3. It defines interface contracts and passive infrastructure (faceplate, ODF, raceway, ELS shelf), with link profiles from DR (1λ) through OCI (4+4) to DWDM 16 across CPO, NPO, XPO, and CPX OE classes for XPU and switch platforms. Targets: RAS-enhanced 72→1,024+ XPU scale-up, MFU 55–65%, <5 pJ/bit, generation-invariant fiber. APAC can lead the open photonics implementation era — the spec is ours to co-author, the realization paths ours to walk.
About OCP APAC Summit:
The Open Compute Project (OCP) is bringing together APAC communities for a two-day, in-person Summit to explore the many challenges and opportunities facing data center infrastructure, today and tomorrow. The event will showcase the latest innovations and technical advancements from around the world, and feature talks from experts who are researching, designing, building and running the next generation of hyperscale data center facilities and infrastructure. The Expo Hall will bring together buyers and sellers from the entire ecosystem and supply chain.