L200
3D CPO

Built for next–gen XPUs and Switches

Passage™ L200 3D co-packaged optics (CPO) delivers up to 256 Tbps total I/O bandwidth per XPU package. An advanced-node electronic integrated circuit (EIC) from Alphawave Semi is 3D integrated on the Passage photonic integrated circuit (PIC) using a standard chip-on-wafer (CoW) process. Pluggable fiber couplers included.

BEYOND THE LIMITS OF 2D

L200 3D CPO with SerDes throughout the EIC die area, achieving > 1.5 Tbps/mm. Outperform shoreline-limited technologies like conventional CPO, NPO, and pluggables.

High–Density Light Engine

The Guide™ Light Engine supports the L200 3D CPO. 16 wavelength DWDM. Unprecedented optical power and reliability.

SPECIFICATIONS

L200

NRZ modulation
Total Bandwidth

L200X

High-speed PAM4 (Pulse Amplitude Modulation)
Total Bandwidth

EIC by Alphawave

Multi-row SerDes for massive escape bandwidth
Ease of integration with existing XPU designs. Standard UCIe.

General

Wavelengths per fiber
High density fiber attach
Pluggable fiber attach
Low total-cost-of-ownership

L200/L200X 3D CPO and Guide™ light engine

Applications

XPU

256 Tbps OF TOTAL I/O BANDWIDTH

Switch

512 Tbps OF TOTAL I/O BANDWIDTH