L200
3D CPO

Built for next–gen XPUs and Switches

Passage™ L200 3D co-packaged optics (CPO) delivers up to 256 Tbps total I/O bandwidth per XPU package. An advanced-node electronic integrated circuit (EIC) from Alphawave Semi is 3D integrated on the Passage photonic integrated circuit (PIC) using a standard chip-on-wafer (CoW) process. Pluggable fiber couplers included.

BEYOND THE LIMITS OF 2D

L200 3D CPO with SerDes throughout the EIC die area, achieving > 1.5 Tbps/mm. Outperform shoreline-limited technologies like conventional CPO, NPO, and pluggables.

High–Density Light Engine

The Guide™ Light Engine supports the L200 3D CPO. 16 wavelength DWDM. Unprecedented optical power and reliability.

High-density light engine from Lightmatter, demonstrating advanced technology

SPECIFICATIONS

L200

NRZ modulation
Icon representing 32 Tbps data transfer speed capability
Total Bandwidth

L200X

High-speed PAM4 (Pulse Amplitude Modulation)
Total Bandwidth

EIC by Alphawave

Icon showing 320 SerDes for data communication
Multi-row SerDes for massive escape bandwidth
UCIE die illustration showcasing the integrated circuit
Ease of integration with existing XPU designs. Standard UCIe.

General

Icon representing 16 wavelengths for optical communication
Wavelengths per fiber
High density fiber attach
Illustration of a plug design for Lightmatter technology integration
Pluggable fiber attach
Illustration symbolizing financial savings through Lightmatter technology
Low total-cost-of-ownership

L200/L200X 3D CPO and Guide™ light engine

Applications

Lightmatter L200 Module 6 product close-up showing detailed components

XPU

256 Tbps OF TOTAL I/O BANDWIDTH

Another view of Lightmatter L200 Module 6 highlighting the technology's precision

Switch

512 Tbps OF TOTAL I/O BANDWIDTH