Electronics Packaging Technology Conference
Presenter: Sandeep Sane, VP and Head of Packaging
Title: 3D Photonic Architectures and Advanced Packaging for Scalable AI
Abstract: Silicon Photonics has become an essential technology for meeting the unprecedented compute and connectivity demands driving the AI revolution. Lightmatter is a leading co-packaged optics provider with a vision of delivering vertically integrated interconnect solutions for next-generation AI data centers. This talk will highlight Lightmatter’s product and technology portfolio, enabling unprecedented bandwidth and scalable connectivity for AI infrastructure. It will cover key advances across silicon photonics and advanced packaging—from novel 3D photonic architectures to large-scale deployment—and the technical challenges involved in bringing these innovations to volume production. The talk will also examine how Silicon Photonics and Advanced Packaging work together to reshape HPC architecture, addressing the critical technical and commercial challenges to achieving scalable adoption.
Date: December 1, 2026
About EPTC:
The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Joint Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region. Topics covered includes the complete spectrum of electronics packaging technology. EPTC will feature keynotes, technical sessions, invited talks, panels, workshops, exhibitions, and networking activities.