Photonic
Chips
for AI
Chips are becoming physically larger and more power hungry due to fundamental, physical limitations of transistors. Compute performance roadmaps are now defined by silicon-area-per-package and the number of processors tightly linked in a high bandwidth scale-up domain. The quest for AGI is driving this trend at warp speed.
Chip scale over time
(MM2)
A bright foundation for big chips
We enable the silicon-area-per-package scaling roadmap, shatter the concept of “beachfront” and bring networking radices to new highs with our breakthrough interconnect and packaging technology platform—Passage. We sell the photonic chips that will make building AGI possible (and the lasers that power them). From single reticle to wafer-scale, the world’s fastest (and first) 3D-stacked photonic chips.
(Reconfigurable Optical Interposer with Integrated Controller)
Driving photonics standardization
Lightmatter is working across leading industry standards organizations to push the envelope of AI interconnect and networking standards and propel AI infrastructure into the photonic era.
Accelerating AI Through Industry Collaboration
Lightmatter is at the forefront of silicon photonics innovation, fostering collaboration through partnerships with leading industry organizations like the Global Semiconductor Alliance (GSA) and Optica to facilitate adoption and unlock the full potential of AI.
