IMAPS SiPhotonics Packaging Summit 2026
Presenter: Jessie Rosenberg, Senior Principal Laser Architect, Engineering & Operations
Title: From TOSA to Foundry: Rethinking Laser Integration for Co-Packaged Optics
Abstract: As silicon photonics advances toward co-packaged optics and 3D photonic interposers, the laser has become the hardest component to place. This talk explores the key packaging tradeoffs — thermal management, real estate, reliability, and serviceability — that shape where and how light sources integrate into next-generation optical engines. We introduce Very Large Scale Photonics (VLSP) lasers, an approach that moves laser integration from discrete, manually assembled components into a scalable, foundry-based platform, and show how this shift improves density, resilience, and manufacturability at rack scale.
Date: October 1, 2026
Time: 11:30 AM
About: IMAPS SiPhotonics Packaging Summit is dedicated to advancing the state-of-the-art in silicon photonics and co-packaging optics. The Summit will bring together leaders from across the silicon photonics ecosystem, including IDM/fabless companies, foundries/OSATs, EDA and equipment/material suppliers, academia, research institutes, and marketing organizations. The goal is to create a focused forum for sharing insights, discussing challenges, and fostering collaborations in Si photonics packaging.