Photonic
Chips
for AI
Chips are becoming physically larger and more power hungry due to fundamental, physical limitations of transistors. Compute performance roadmaps are now defined by silicon-area-per-package and the number of processors tightly linked in a high bandwidth scale-up domain. The quest for AGI is driving this trend at warp speed.
Chip scale over time
(MM2)
A bright foundation for big chips
We enable the silicon-area-per-package scaling roadmap, shatter the concept of “beachfront” and bring networking radices to new highs with our breakthrough interconnect and packaging technology platform—Passage. We sell the photonic chips that will make building AGI possible (and the lasers that power them). From single reticle to wafer-scale, the world’s fastest (and first) 3D-stacked photonic chips.
(Reconfigurable Optical Interposer with Integrated Controller)
This is the way (follow me).
We partner with companies that build high-performance chips (like GPUs and switches) to achieve extreme scaling. Connect hundreds to millions of chips together in a single, high bandwidth, low latency interconnect domain. At Lightmatter, we’re blurring the line between scale-up and scale-out networks.