Monolithically Integrated Microring Transmitter and Receiver for High-Density 3D Co-Packaged Optics

Abstract: We report silicon microring transmitter and receiver with monolithically integrated driver and analog front end at up to 64Gbps NRZ. The total die area of the circuits is 0.006 mm², >10x smaller than prior reports. Authors: Reza Baghdadi, Carlos Dorta-Quinones, Alexander Sludds, Shashank Gupta, Pietro Ciccarella, Bryce Gardiner, Joyce K. S. Poon, Darius Bunandar, Nicholas Harris