IEEE ITherm 2026
The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Location: Grande Lakes Resort in Orlando, FL
Presenter: Yuanchen Hu, Staff Thermal Engineer
Title: Thermal Analysis of Advanced 3D Co-packaged Optics
Abstract: We present numerical simulations of a 3D CPO solution with both switch and GPU architectures, employing a single-phase liquid-cooled cold plate. Our analysis investigates the optimal number of Photonic Integrated Circuits (PICs) and Electronic Integrated Circuits (EICs) and precisely quantifies the thermal cross-talk between these components.
Date: May 28, 2026
Time: 8:30 AM
Panelist: Yuanchen Hu, Staff Thermal Engineer
Title: Advanced Mechanics and Reliability
Abstract: This panel will include experts from industry and academia to discuss the emerging needs for reliability and deviations from legacy requirements and methodologies. Application spaces include aerospace, vehicles, and datacenter/AI operations, power electronics, materials. The panel members will discuss examples of where existing accelerated testing standards fall short and where specific electronics applications and environmental demand improved qualification methods to meet requirements for mission-critical functions.
Date: May 28, 2026
Time: 4:00 PM
About IEEE ITherm:
ITherm 2026 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)