L200
3D CPO
Built for next–gen XPUs and Switches
Passage™ L200 3D co-packaged optics (CPO) delivers up to 256 Tbps total I/O bandwidth per XPU package. An advanced-node electronic integrated circuit (EIC) from Alphawave Semi is 3D integrated on the Passage photonic integrated circuit (PIC) using a standard chip-on-wafer (CoW) process. Pluggable fiber couplers included.

BEYOND THE LIMITS OF 2D
L200 3D CPO with SerDes throughout the EIC die area, achieving > 1.5 Tbps/mm. Outperform shoreline-limited technologies like conventional CPO, NPO, and pluggables.
High–Density Light Engine
The Guide™ Light Engine supports the L200 3D CPO. 16 wavelength DWDM. Unprecedented optical power and reliability.

SPECIFICATIONS

L200
NRZ modulation
Total Bandwidth
L200X
High-speed PAM4
(Pulse Amplitude Modulation)
Total Bandwidth
EIC by Alphawave
Multi-row SerDes for massive escape bandwidth
Ease of integration with existing XPU designs. Standard UCIe.
General
Wavelengths per fiber
High density fiber attach
Pluggable fiber attach
Low total-cost-of-ownership
L200/L200X 3D CPO and Guide™ light engine
Applications

XPU
256 Tbps OF TOTAL I/O BANDWIDTH

Switch
512 Tbps OF TOTAL I/O BANDWIDTH