Hot Interconnects 2025, Nick Harris, CEO & Founder

Title: Transforming AI Infrastructure with the Power of 3D Photonics Abstract: 3D photonics’ edgeless I/O paradigm overcomes the reach and bandwidth limits of traditional interconnects, linking thousands of GPUs with unprecedented scale-up throughput and energy efficiency. This talk will unpack the enabling technologies—silicon photonics integration, 3D packaging and high-density laser arrays—that… Read More

CHIPCon 2025 with Sandeep Sane, Sr. Director, Head of Packaging

Title: Silicon Photonics and Chiplet Integration for Future Compute Platforms Speaker: Sandeep Sane, Sr. Director, Head of Packaging, Lightmatter  Description: Silicon Photonics enables high-speed, energy-efficient data transfer, while Advanced Packaging—including 2.5D/3D integration and chiplet architectures—enhances performance, thermal management, and interconnect density. This session explores how these complementary technologies are reshaping… Read More