This is my archive

High-Bandwidth Optical Links, Nikhil Kumar, Senior Director, Photonics

Title: 16-Wavelength 800-Gbps Bidirectional Link over Single-Mode Fiber Using Microring Transceivers This presentation demonstrates a 16λ bidirectional DWDM link achieving 800 Gbps per fiber with silicon microring transceivers. The system delivers high efficiency (~2.6 pJ/bit), low loss, and stable performance across long-reach fiber and varying thermal conditions. It highlights scalable… Read More

Yole Group Market Briefing, Nikhil Kumar, Senior Director

Title: Advancing AI performance with 3D photonic interconnects Lightmatter presents its latest advancements in 3D photonics for AI infrastructure, highlighting how photonic interconnects address the growing bandwidth, power, and scalability challenges of modern AI systems. The presentation explores the company’s Passage™ platform and Guide® light engine, demonstrating high-density, multi-wavelength optical… Read More

PECC Summit 2025, Darius Bunandar, Chief Scientist

Title: Scaling up AI networking with 3D photonics Session 1: Hyperscalers and System Company Perspectives Industry leaders discuss the future of data centers and cloud infrastructure, focusing on the evolving dynamics between hyperscale giants and their critical technology suppliers. In particular, the influence of mainstream AI on cloud computing will… Read More

SMTA International 2025, Jessie Rosenberg, Director of Laser Engineering Lightmatter

Title: Scaling AI with Photonic Interconnects: Integration and Manufacturability Abstract: As artificial intelligence (AI) datacenters continue their rapid expansion, they face significant hurdles in interconnect bandwidth, power consumption, and latency. While silicon photonics offers a promising solution to these challenges, its widespread adoption has historically been hampered by complexities in… Read More

SEMICON Taiwan 2025, Sandeep Sane, Sr. Director, Head of Packaging Technologies

Title: Photonic-Enabled Heterogeneous Integration: The Future of AI System Scaling Abstract: The exponential growth of artificial intelligence and the slowing of Moore’s Law demand a new paradigm for system performance and efficiency. 3D photonic integration of heterogeneous technologies provides a cornerstone for a transformative roadmap that addresses the critical communication… Read More

ISES Korea 2025, Ritesh Jain, SVP Engineering and Operations

Title: From Electrons to Photons: A Lightmatter Perspective on 3D Photonic Interconnect Abstract: Silicon Photonics has become an essential technology to meet the needs of compute demands which are fueling the AI revolution. Lightmatter is a leading co-packaged optics solution provider in this market with a vision of delivering complete… Read More

Hot Interconnects 2025, Taylor Groves, Principal Solutions Architect

Title: Accelerating Frontier MoE Training with 3D Integrated Optics Authors: Taylor Groves, Mikhail Bernadskiy, Ho John Lee, Peter Carson, Thomas Graham and Eric Yeh  Abstract: In a new era of AI, high-speed interconnects are becoming the new scaling engine as traditional semiconductor scaling slows. This presentation explores how 3D-stacked optics can… Read More