Production, Packaging and Test

This session introduces Lightmatter’s approach to CPO enabled AI systems, including 2D, 2.5D, and 3D photonic integration strategies and the Passage platform for high-density, low power optical interconnects and matches it to AI system design goals. It outlines the industry challenges slowing CPO adoption such as fragmented supply chains, manufacturing complexity, thermal and packaging constraints, and the absence of open, interoperable standards, and presents a proposal for an open, collaborative model to accelerate High Volume Manufacturing (HVM) readiness.