This session introduces Lightmatter’s technology and product reliability qualification methodology, including the systematic integration of reliability activities across the entire product life cycle. With the integration of EIC and PIC into a single package, we present a rigorous and multi-level qualification process to address thermal management and field serviceability challenges. We provide an in-depth look at qualification tests to ensure the long-term reliability of CPO products, from fundamental device aging (PICs/EICs) and package-level thermal/mechanical endurance to overall system level reliability under operational and accelerated stress conditions.