CPO Production, Packaging and Quality

This session introduces Lightmatter’s production roadmap for CPO-enabled AI systems, detailing the 2D, 2.5D, and 3D photonic integration strategies utilized by the Passage™ platform. We explore how its high-density, low-power designs are engineered to meet the bandwidth, efficiency and reliability demands of next-generation AI interconnects. To address industry-wide scaling challenges, the presentation outlines a collaborative model built on open, interoperable standards designed to streamline supply chains and manufacturing. Finally, we introduce optimized process flows that resolve critical thermal and packaging constraints, providing a clear path to High-Volume Manufacturing (HVM) readiness for co-packaged optics.