Scaling Up Networking for AI: Unlocking the Full Potential of Optical Interconnects Speakers: Cliff Grossner, Chief Innovation Officer, Open Compute Project (OCP) Sameh Boujelbene, VP, Ethernet Switch—Data Center and AI Networks for AI Workloads Market Research, Dell’Oro Group Ritesh Jain, Senior Vice President, Engineering & Operations, Lightmatter Steve Klinger, VP… Read More
At the AI Infrastructure Summit 2025 in Santa Clara, Steve Klinger, VP Product at Lightmatter, explains why the real challenge in scaling AI is no longer compute, but the interconnect. He outlines how Lightmatter’s photonic technologies—including Passage and L-series co-packaged optics—are unlocking unprecedented bandwidth, reducing training times, and reshaping the… Read More
Title: Transforming AI Infrastructure with the Power of 3D Photonics Abstract: 3D photonics’ edgeless I/O paradigm overcomes the reach and bandwidth limits of traditional interconnects, linking thousands of GPUs with unprecedented scale-up throughput and energy efficiency. This talk will unpack the enabling technologies—silicon photonics integration, 3D packaging and high-density laser arrays—that make… Read More
Title: Accelerating Frontier MoE Training with 3D Integrated Optics Authors: Taylor Groves, Mikhail Bernadskiy, Ho John Lee, Peter Carson, Thomas Graham and Eric Yeh Abstract: In a new era of AI, high-speed interconnects are becoming the new scaling engine as traditional semiconductor scaling slows. This presentation explores how 3D-stacked optics can… Read More
Lightmatter has achieved a world-first in optical communications: a 16-wavelength bidirectional DWDM link on a single strand of standard single mode optical fiber. This groundbreaking achievement represents an 8X leap in bidirectional fiber bandwidth density and a doubling of radix, paving the way for the next generation of AI data… Read More
Explore the Passage M1000 Reference System, a groundbreaking platform built around the Passage M1000 3D Photonic Superchip. Discover how this revolutionary photonic interconnect technology is changing the game for Artificial Intelligence (AI) infrastructure by enabling massive scale-up bandwidth and radix, connecting GPUs, TPUs and data center switches in the largest… Read More
Ready, Set, Compute: The AI Chip Race Up Close – AI chip manufacturing is evolving rapidly to meet the demands of high-performance computing and AI-driven applications. This session explores the latest advancements, challenges, and trends shaping the future of AI chip technology. Read More
The Next Era of AI Infrastructure – Progress in AI hinges on humanity’s ability to drive the performance of computer chips. As traditional chip scaling laws reach their limits, questions revolve around the speed at which technology will progress and what infrastructure will support that growth. Join Lightmatter co-founder and… Read More
Lightmatter Founder and CEO Nick Harris Unveils Passage L200 3D Co-Packaged Optics and Passage M1000 3D Photonic Superchip… Read More
