3D PHOTONICS FOR AI

The Passage 3D Silicon Photonics Engine supports from single-chip to multi-die complexes and all the way to wafer-scale—the world’s fastest interconnect.

UNMATCHED SCALE-UP

Increase your scale-up domain by > 30x with Passage DWDM bidirectional links and ultra-dense fiber attach. Unmatched radix.

INTEGRATED CONTROL

Works with off-the-shelf chips, thanks to integrated transistor and photonics control technology.

3D PHOTONICS PACKAGING

Unmatched Photonic Bandwidth Density with Passage 3D Packaging: From Individual Chiplets to Expansive Multi-Chiplet Architectures.

1 MILLION XPUS AND BEYOND