SMTA Wafer-Level Packaging Symposium
February 17-19, 2026
Location: Hyatt Regency San Francisco Airport
Keynote Title: 3D Photonic Interposers: Lighting the Path Beyond Moore’s Law
Presenter: Ritesh Jain, SVP Engineering & Operations
Abstract: As massive parallelism has supplanted traditional semiconductor scaling laws as the engine driving compute performance, connectivity bandwidth has become the growth bottleneck for AI infrastructure. With electrical interconnects nearing their physical limits, silicon photonics has emerged as a crucial enabling technology for meeting the escalating demands of modern computing and AI. To unlock the full potential of this technology, 3D photonic interposers like Passage combine the power of silicon photonics with multi reticle die complexes to enable AI performance previously unattainable in the data center market. This presentation will detail the development of next-generation photonic interconnect solutions that significantly enhance performance and energy efficiency for advanced AI workloads. We’ll explore the complex engineering and packaging challenges inherent in bringing these innovations to fruition and scaling them for broader adoption. This includes discussions on novel photonic chip architectures and the robust integration strategies vital for ecosystem development. Ultimately, this presentation will demonstrate how advanced 3D photonic interposers and their physical implementation is fundamentally transforming the capabilities of AI hardware beyond Moore’s law.
Date: February 18, 2026
Time: 11:30 AM
About Wafer-Level Packaging Symposium:
Addressing wafer-level packaging, 3D, and Advanced Manufacturing & Test technologies, the Wafer-Level Packaging Symposium will be at the forefront of packaging technology evolution. The conference will feature an international audience gathering in the heart of Silicon Valley to immerse themselves in the latest technology and business trends. This event is produced by SMTA, the distinguished global association representing electronic assembly and manufacturing professionals.
Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)