PIC Summit USA
Keynote: Reinventing the Physical Layer: The Path to the Million-XPU AI Data Center
Presenter: CEO & Founder Nick Harris
We introduce Lightmatter’s approach to reinventing the physical layer of networking, utilizing the Passage photonic interconnect platform to enable 100x more bandwidth and create “single-brain” data centers capable of linking 1,000,000 XPUs. By moving from traditional pluggables to 3D photonics, we demonstrate energy efficiencies of 2 pJ/bit with edgeless I/O. Key advancements in silicon photonics, 3D packaging, and high-density laser integration enable this transformation. Finally, we present simulation data showing how this optical interconnect architecture significantly reduces training time for massive Mixture of Experts (MoE) models compared to traditional electrical scale-up architectures.
Date: Monday, January 19, 2026
Time: 1:20 PM
About PIC Summit USA:
As the global demand for faster, more energy-efficient chips grows, integrated photonics are at the center of this transition. PhotonDelta and Plug and Play cordially invite you to attend PIC Summit USA on Monday, January 19. This invite-only event aims to strengthen North America’s silicon photonics ecosystem and build new collaborations with international markets and cutting-edge technologies.
Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)