ISSCC (IEEE International Solid-State Circuits Conference)
February 15 -19, 2026
Location: San Francisco Marriott Marquis
Title: Scaling AI with Light: 3D Photonic Solutions for Next-Gen Connectivity
Presenter: Ritesh Jain, SVP Engineering & Operations
Abstract: Silicon photonics has emerged as a key technology to break through the limits of traditional electrical interconnects to meet the growing demands of modern computing and AI. This presentation will describe the role of 3D photonic solutions, such as PassageTM, to enable higher energy efficiency and bandwidth for advanced AI workloads. It will cover the development of next-generation photonic interconnect solutions, the engineering and packaging challenges and the approaches required for broader adoption. The discussion will include photonic chip architectures, integration strategies, and ecosystem considerations required to realize these solutions.
Date: February 15, 2026
Time: 3:15 PM (Forum 2)
About International Solid-State Circuits Conference:
The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts.
Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)