May 12–13, 2026
Taipei, Taiwan
ISIG Executive Summit Taiwan
Grand HiLai Taipei
May 12-13, 2026
Location: Grand HiLai Taipei
Presenter: Boon Tan, VP Product Engineering
Title: Scaling CPO
Date: May 12, 2026
Time: 11:30 AM
About ISIG Executive Summit:
ISIG brings together senior leaders and innovators to address the most critical challenges and opportunities in semiconductors. These summits go beyond discussion – enabling collaboration that drives long-term industry progress.
Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)