ISIG Executive Summit Taiwan
May 12-13, 2026
Location: Grand HiLai Taipei
Presenter: Boon Tan, VP Product Engineering
Title: 3D Photonic Solutions: Lighting the Path Beyond Moore’s Law
Abstract:
Interconnect progress is currently too slow, bottlenecking the next 1000x in AI performance. Existing interconnects are limited by chip shoreline, copper, and power consumption. This presentation will give an overview the challenges and reveal how 3D silicon photonics offers a new paradigm to solve these critical interconnect challenges. It will also cover Lightmatter’s roadmap featuring 3D CPO/Interposers and Very large-Scale Photonics (VLSP) lasers for 100x speedup and ultra-low power. Finally, the talk will outline the challenges for scaling CPO to high volume and the role of ecosystem collaboration in enabling a smooth CPO ramp.
Date: May 12, 2026
Time: 11:30 AM
About ISIG Executive Summit:
ISIG brings together senior leaders and innovators to address the most critical challenges and opportunities in semiconductors. These summits go beyond discussion – enabling collaboration that drives long-term industry progress.
Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)