ISIG Executive Summit USA 2026
April 20-21, 2026
Location: Plug and Play Tech Center, Santa Clara, CA
Presenter: Ritesh Jain, SVP, Engineering & Operations
Panel: Co-Packaged Optics: Innovations, Scaling Challenges and Deployment Roadmap
Abstract: An executive-level discussion on the latest innovations in co-packaged optics, examining scalability challenges, manufacturing readiness, and the practical roadmap to commercial deployment in next-generation data center and AI infrastructure.
Date: April 20, 2026
Time: 11:30 AM
About ISIG Executive Summit:
ISIG brings together senior leaders and innovators to address the most critical challenges and opportunities in semiconductors. These summits go beyond discussion – enabling collaboration that drives long-term industry progress.
Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)