IEEE ITherm 2026
The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Location: Grande Lakes Resort in Orlando, FL
Presenter: Yuanchen Hu, Staff Thermal Engineer
Title: Thermal Analysis of Advanced 3D Co-packaged Optics
Abstract: We present numerical simulations of a 3D CPO solution with both switch and GPU architectures, employing a single-phase liquid-cooled cold plate. Our analysis investigates the optimal number of Photonic Integrated Circuits (PICs) and Electronic Integrated Circuits (EICs) and precisely quantifies the thermal cross-talk between these components.
About IEEE ITherm:
ITherm 2026 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)