Hot Interconnects 2026

August 19-21, 2026

Location: Virtual

Presenter: Nick Harris, Ph.D., Founder and CEO

About Hot Interconnects:
IEEE Hot Interconnects is the premier international forum for researchers and developers of state of the art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.

Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)