Chiplet Summit
February 17-19, 2026
Location: Santa Clara Convention Center
Presenter: Steve Klinger, VP of Product
Title: Overcoming AI Scaling Barriers with Light. 3D Stacked Photonic Solutions for the Chiplet Era
Abstract: Silicon photonics has emerged as a key technology to break through the limits of traditional electrical interconnects to meet the growing demands of modern computing and AI. This presentation will describe the role of 3D photonic solutions, such as PassageTM, to enable dramatically higher bandwidth and radix for advanced AI architectures. It will outline a new generation photonic “optical engine” interconnect solutions that can readily leverage chiplet-based approaches and D2D interfaces to unlock the next wave of scaling.
Date: February 17, 2026
Time: Part of session D from 8:30 AM to 12:00 PM
About Chiplet Summit:
The Chiplet Summit is the largest, focused annual technical conference and trade show dedicated entirely to the emerging chiplet market, featuring keynotes, exhibits, and tutorials from industry leaders. It covers the entire chiplet ecosystem, including design, manufacturing, advanced packaging (2.5D/3D), die-to-die interfaces (e.g., UCIe), and AI applications.