SMTA International 2025, Jessie Rosenberg, Director of Laser Engineering Lightmatter
Title: Scaling AI with Photonic Interconnects: Integration and Manufacturability
Abstract: As artificial intelligence (AI) datacenters continue their rapid expansion, they face significant hurdles in interconnect bandwidth, power consumption, and latency. While silicon photonics offers a promising solution to these challenges, its widespread adoption has historically been hampered by complexities in integration and reliability.
This talk will trace the progression of photonic interconnects in datacenters, highlighting their journey towards increasingly tighter integration with computing architectures, and delve into the technical advancements that have propelled this progress, making high-performance, energy-efficient optical communication a reality. Furthermore, we’ll present a dense 3D integration approach designed to deliver unparalleled bandwidth density, ensuring that future AI models have the computational foundation required for efficient scaling into the future.