Hot Interconnects 2025, Taylor Groves, Principal Solutions Architect

Title: Accelerating Frontier MoE Training with 3D Integrated Optics

Authors: Taylor Groves, Mikhail Bernadskiy, Ho John Lee, Peter Carson, Thomas Graham and Eric Yeh 

Abstract: In a new era of AI, high-speed interconnects are becoming the new scaling engine as traditional semiconductor scaling slows. This presentation explores how 3D-stacked optics can link thousands of GPUs across multiple data center racks, overcoming the distance limitations of traditional copper interconnects while meeting aggressive power and performance targets. Our modeling demonstrates how Passage 3D photonic interconnects enables a substantial increase in scale-up capability, resulting in a 2.7X reduction in the time needed to train massive AI models like Mixture of Experts (MoE) models. This advancement unlocks new opportunities for model scaling and performance.