SEMICON Taiwan
Session: Day 1: Heterogeneous Integration Global Summit 2025
Theme: Powering AI Innovations with Advanced System Integration Technology
Title: Photonic-Enabled Heterogeneous Integration: The Future of AI System Scaling
Speaker: Sandeep Sane, Sr. Director, Head of Packaging Technologies
Date: Tuesday, September 9, 2025
Venue: 701GH, 7F, Taipei Nangang Exhibition Center Hall 2
Location: Taipei, Taiwan
Abstract: The exponential growth of artificial intelligence and the slowing of Moore’s Law demand a new paradigm for system performance and efficiency. 3D photonic integration of heterogeneous technologies provides a cornerstone for a transformative roadmap that addresses the critical communication bottlenecks that will drive AI innovation.
Lightmatter’s photonic interconnects, using an “edgeless I/O” silicon design, unlocks massive scale-up bandwidth for system-in-package architectures. By facilitating direct, high-density, low-latency optical connections between co-packaged silicon, these AI systems can become significantly more powerful and efficient. Key advancements in silicon photonics, 3D packaging, and high-density laser integration enable this transformation. The fusion of these technologies forges the path toward breakthrough power efficiencies and terabit-per-second-per-millimeter connectivity, building the next generation of AI infrastructure.
About SEMICON Taiwan: SEMICON TAIWAN is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between the industry, the government, academia, and research institutions. Witnessing enormous business collaboration, SEMICON TAIWAN still stays true to its missions― Leading Technology Trends, Driving Technology Innovation, and Facilitating Collaboration and continues providing various channels and activities that meet the companies’ marketing and promotion needs.
Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)