OCP Webinar: Scaling Up Networking for AI: Unlocking the Full Potential of Optical Interconnects

Scaling Up Networking for AI: Unlocking the Full Potential of Optical Interconnects

Date: Tuesday, October 07, 2025

Time: 8 AM PT / 11 AM ET

Location: Virtual

Speakers:

Cliff Grossner, Chief Innovation Officer, Open Compute Project (OCP)

Sameh Boujelbene, VP, Ethernet Switch—Data Center and AI Networks for AI Workloads Market Research, Dell’Oro Group

Ritesh Jain, Senior Vice President, Engineering & Operations, Lightmatter

Steve Klinger, VP of Product, Lightmatter

Description:

The rapidly evolving landscape of frontier AI models is fueling relentless growth and complexity in data center workloads. The resulting challenges in optimizing performance, power and efficiency is driving the need for a new generation of high-bandwidth, low-latency interconnects. As traditional semiconductor scaling slows, the reach limitation of electrical interconnects and the power and cost constraints of pluggable optics, re-timers, and active cables are limiting the performance of AI scaling. This webinar will provide a technical tutorial on the evolution of interconnects to meet hyperscale AI data center requirements. We will explore the shift to in-package optics, detailing the architectural differences between 2D- and 3D-integrated photonic solutions. We will discuss Lightmatter 3D co-packaged optics (CPO) and optical interposer implementations, highlighting the key differentiations in bandwidth density, energy efficiency, and latency. The session will conclude with a discussion about the key technical challenges and solutions in deploying these technologies at scale, including thermals, packaging integration, and mass production, drawing on insights from industry experts, recent development breakthroughs and other authoritative technical sources.

Register Now

Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)