SEMICON Taiwan 2025, Sandeep Sane, Sr. Director, Head of Packaging Technologies
Title: Photonic-Enabled Heterogeneous Integration: The Future of AI System Scaling
Abstract: The exponential growth of artificial intelligence and the slowing of Moore’s Law demand a new paradigm for system performance and efficiency. 3D photonic integration of heterogeneous technologies provides a cornerstone for a transformative roadmap that addresses the critical communication bottlenecks that will drive AI innovation.
Lightmatter’s photonic interconnects, using an “edgeless I/O” silicon design, unlocks massive scale-up bandwidth for system-in-package architectures. By facilitating direct, high-density, low-latency optical connections between co-packaged silicon, these AI systems can become significantly more powerful and efficient. Key advancements in silicon photonics, 3D packaging, and high-density laser integration enable this transformation. The fusion of these technologies forges the path toward breakthrough power efficiencies and terabit-per-second-per-millimeter connectivity, building the next generation of AI infrastructure.