Hot Interconnects 2025
Title: Transforming AI Infrastructure with the Power of 3D Photonics Speaker: Nicholas Harris, Founder & CEO
Description: 3D photonics’ edgeless I/O paradigm overcomes the reach and bandwidth limits of traditional interconnects, linking thousands of GPUs with unprecedented scale-up throughput and energy efficiency. This talk will unpack the enabling technologies—silicon photonics integration, 3D packaging and high-density laser arrays—that make faster, more efficient AI model training and next-generation data-center architectures possible.
When and Where:
Date: Wednesday, August 20th, 2025
Time: 10:30 AM PDT
Location: Virtual
Title: Technical Paper Session B: Co-packaged Optics: Accelerating Frontier MoE Training with 3D Integrated Optics: Taylor Groves, Principal Solutions Architect
When and Where:
Date: Wednesday, August 20th, 2025
Time: 12:30 PM PDT
Location: Virtual
About Hot Interconnects:
The latest advancements in photonics, chips, parallel paths, and other cutting-edge interconnect technologies are dazzling. However, the picture is incomplete without the system software needed to exploit their full potential. This edition of Hot Interconnects will explore the underlying software ecosystems that empower interconnect fabrics to support a wide array of applications.
Don’t miss Darius Bunandar at Hot Chips the following week!
Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)