Presentation
CHIPCon 2025 with Sandeep Sane, Sr. Director, Head of Packaging
Title: Silicon Photonics and Chiplet Integration for Future Compute Platforms
Speaker: Sandeep Sane, Sr. Director, Head of Packaging, Lightmatter
Description: Silicon Photonics enables high-speed, energy-efficient data transfer, while Advanced Packaging—including 2.5D/3D integration and chiplet architectures—enhances performance, thermal management, and interconnect density.
This session explores how these complementary technologies are reshaping high-performance computing. We’ll discuss their current maturity, integration pathways, and key challenges to large-scale deployment. Together, they provide the foundation needed to meet the compute and bandwidth demands of an AI-driven future.