Passage M1000 EVK
3D Photonic Interposer for Exascale AI
The M1000 is the world’s first 3D Photonic Superchip. The M1000 reference platform consists of a server with all components needed to operate the chip. An array of 32 I/O chiplets and two thermal load chips are 3D stacked in a chip-on-wafer process on the M1000 photonic interposer. M1000 eliminates the “shoreline bottleneck” by allowing any chip on its surface to direct all of its I/O bandwidth to the optical fibers, enabling unbound bandwidth for next-generation AI accelerators and switches. Detachable fiber array units at a massive scale enable serviceability for a record-breaking platform.
Challenge
The Shoreline Bottleneck
Traditional chips are limited by their perimeter (shoreline), which is where I/O devices for communication reside. As chips get larger, the edge-to-area ratio drops, starving the core of bandwidth.
This fundamental geometric limit sets a bound on how much I/O bandwidth can escape a chip and therefore limits AI scaling.
Perimeter-Limited Chip
I/O confined to the edge. Core bandwidth starved.
M1000 Platform
Engineered for Rack Scale
The M1000 evaluation kit demonstrates 3D photonic integration at scale, from chip-level innovation to rack-scale deployment.
Edgeless I/O Interposer
A 4,000 mm² photonic interposer with 256 fiber connections for high-density optical integration.
Detachable Fibers with eClick Optics
Enabling serviceability and repair in the field.
Rack-Scale Validation
Passage M1000 EVK is deployed in our validation data center.
Hardware Tour at Supercomputing 2025
Explore the hardware powering next-generation photonic interconnect. See the world’s first photonic interposer in action. Watch live reliability testing and rack-level integration demonstrations.